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Cyrix III/C3:

VIA Cyrix III-750A MHz, Engineering Sample

VIA C3-750A MHz, Engineering Sample

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Cyrix III/C3

VIA Cyrix III-750A MHz, Engineering Sample


VIA Cyrix III Processor VIA Cyrix III-750AMHz (100 x 7.5) HEATSINK/FAN REQUIRED	C5B ES Lot#CE2133.C5 Wafer#19 BIN#3 1.7V/100

By 2001, the Samuel 2 (C5B) was released, this time just as the VIA C3. Samuel 2 ran at a higher clock speed and added a level 2 cache, required lower voltage and was also available in an Enhanced Ball Grid Array (EBGA) version. EBGA allowed the CPU to be mounted directly onto a motherboard without using Intel's costly Socket 370.

This is a Samuel 2 Engineering Sample, still marked Cyrix III and in PGA package.

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Core Frequency:	750 MHz
Board Frequency:	100 MHz
Clock Multiplier:	7.5
Data bus (ext.):	64 Bit
Address bus:	32 Bit
Transistors:	15,200,000
Circuit Size:	0.15 µ
Voltage:	1.7 V
Introduced:	May 28, 2001
L1 Cache:	64+64 KB
L2 Cache:	64 KB
CPU Code:	Samuel 2 C5B
Package Type:	Ceramic PGA-370
Socket:	370

VIA C3-750A MHz, Engineering Sample


C3 Processor VIA C3-750AMHz (100 x 7.5) HEATSINK/FAN REQUIRED	(C)(M) VIA C3 ES 750MHz (100X7.5) 1.6V AF40JRO 0136 TAIWAN 10625G1

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Core Frequency:	750 MHz
Board Frequency:	100 MHz
Clock Multiplier:	7.5
Data bus (ext.):	64 Bit
Address bus:	32 Bit
Transistors:	15,200,000
Circuit Size:	0.25 µ
Voltage:	1.6 V
Introduced:	May 28, 2001
Manufactured:	week 36/2001
Made in:	Taiwan
L1 Cache:	64+64 KB
L2 Cache:	64 KB
CPU Code:	Samuel 2 C5B
Package Type:	Plastic BGA-336